Ewac Bondtec [551353]™ Trademark
Removed trademark Ewac Bondtec [551353] (WORD) - Chemical substances for use in welding soldering and brazing included in class 1.
![Ewac Bondtec [551353]™ Trademark](https://cdn.tmpsearchers.com/trademark_image/fGBGQgdeYQpTUQ==.jpg "Ewac Bondtec [551353]™ Trademark")
| App number | 551353 |
|---|---|
| As on date | 2021-09-15 |
| Status | Removed |
| Tm application no | 551353 |
| Class | 1 |
| Date of application | 1991-05-20 |
| Appropriate office | MUMBAI |
| State | MAHARASHTRA |
| Country | India |
| Filing mode | Branch Office |
| Tm applied for | EWAC BONDTEC |
| Tm category | TRADE MARK |
| Trade mark type | WORD |
| User detail | 27/03/1981 |
| Certificate detail | Certificate No. 211108 Dated : 31/03/1998 |
| Valid upto renewed upto | 20/05/2015 |
| Proprietor name | (1) EWAC ALLOYS LIMITED Body Incorporate |
| Proprietor address | L AND T HOUSE, BALLARD ESTATE, MUMBAI-400038 |
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| Goods service details | [CLASS : 1] CHEMICAL SUBSTANCES FOR USE IN WELDING SOLDERING AND BRAZING INCLUDED IN CLASS 1. |
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